Thin film interface engineering design is a very important aspect of the field of thin film processing.

The task of this design project is to design a coating on a sapphire substrate which will provide:-
a)A very high strength bond to sapphire and a Nickel based alloy substrate which is water cooled
b)The thin film coating on the saphire, will be wet to the Nickel based alloy at elevated temperature.

This ensemble is the basis for a heat sink device.

Describe in detail your processing route and the various reasons you have chosen your methods and procedures. You should describe in detail your chosen vacuum system and discuss what surface analysis you will perform at each stage to ensure quality assurance.

Diagrams must be hand drawn and scanned. Describe in detail the nature of the interface you are engineering between your chosen thin film and sapphire as well the compatibility with the Nickel based alloy.

a)Describe briefly your protocol strategy in a paragraph (5 pts)
b)Illustrate a flow diagram of each step (5pts)
c)Give reasons for your choice of:- (i) vacuum level(s) used (ii) deposition method(s) (iii) method(s) of analysis to check film integrity (10 pts)

Plagiarism will not be tolerated and will result in a failing grade